TL;DR
## Hot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceiling — firm extends MR-MUF through Nvidia RubinThe problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.
The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.
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*Source: [TomsHardware](https://www.tomshardware.com/tech-industry/semiconductors/sk-hynix-says-hybrid-bonding-wont-be-ready-for-hbm4e-as-ai-memory-runs-into-a-775-micron-ceiling)*