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From Benchmarks to Behavior: Rethinking Performance in Autonomous Robotics
The OpenNav Robotics Workload Benchmark tests autonomous robots running full perception, planning, control, and a 31B VLM simultaneously. AMD Ryzen AI...
Sourcing
Keysight Accelerates AttoTude IC Design Cycles by More Than 50%
Keysight Technologies, Inc. (NYSE: KEYS) today announced that AttoTude Inc., a pioneer of next-generation ASICs over Dielectric interconnect technology for...
Sourcing
AMD Spartan™ FPGA Grows Up: Bigger, Smarter, Scalable, More Secure
AMD Spartan™ UltraScale+™ SU200P FPGA in Production Built for Data Centers, Network Switches, and Industrial Systems The post AMD Spartan™ FPGA Grows Up:...
Sourcing
KYOCERA AVX Releases Vibration-Proof Aluminum Electrolytic Capacitors
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future,...
Sourcing
OpenAI’s 700W Jalapeño ASIC outpaces 1,400W Nvidia flagship GPU — claims up to 1.9x throughput per kilowatt and 3.6x lower latency, co-developed with Broadcom
OpenAI arrived at Hot Chips on Tuesday with benchmarks claiming its first in-house chip beats Nvidia's GB300.
Sourcing
Hot Chips 2026: Samsung makes LPDDR5X smart with logic unit in memory — LPDDR5X-PIM is 3.01x faster than LPDDR5X in AI inference with 8x the bandwidth
Samsung detailed the industry's first LPDDR5X-PIM at Hot Chips 2026, adding logic directly to memory to speed up data-intensive workloads like AI inference.
Sourcing
Infineon acquires C2i Semiconductors to expand its innovation capabilities in AI data center power management solutions
Acquisition strengthens Infineon’s leadership in power solutions for AI data centers and accelerates software-defined power architectures from grid to core...
Sourcing
Showcasing Cutting-Edge RF/Microwave Components at IMS 2026
The team is presenting a microwave application seminar about thin-film sputtering technologies and exhibiting its extensive selection of cutting-edge RF and...
Sourcing
NEW Vibration-Proof Aluminum Electrolytic Capacitors
The new AEVA and AEVB Series aluminum electrolytic capacitors are engineered for harsh industrial environments, delivering high-CV, long-lifetime...
Sourcing
Hot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceiling — firm extends MR-MUF through Nvidia Rubin
The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.
Sourcing
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