Einblicke / Notizen des Sourcing-Desks
Marktnotizen für
die nächste Entscheidung.
Engpass-Beobachtungen, Lieferzeit-Bewegungen und praktischer Beschaffungskontext für Einkaufs- und Technikteams.
Der Artikelindex
Nach Thema lesen.
Nach Bauteil suchen.
Filtern Sie den redaktionellen Index, ohne Datum, Kontext oder die praktische Erkenntnis hinter jeder Notiz zu verlieren.
42 Notizen
Suche & Thema zurücksetzen
STMicroelectronics’ highly integrated power-factor correction controller simplifies continuous conduction mode designs
STMicroelectronics’ L4983 power-factor correction (PFC) controller contains a proprietary multiplier emulator and distortion-optimization circuitry, letting...
Beschaffung
TDK launches industry-leading low-resistance soft-termination X7R MLCCs with 10 μF/100 V in the 3225 format for AI servers, humanoids, and xEVs
– New 100 V SMD component with X7R characteristics has a capacitance of 10 μF in the 3225 format. – Offers low resistance and soft termination for...
Beschaffung
Enterprise SSD Revenue Doubles to Over $37B in 2Q 2026 as AI Demand Lifts Prices, Shipments
AI infrastructure expansion and higher NAND contract prices drove enterprise SSD revenue sharply higher in the second quarter. The post Enterprise SSD...
Beschaffung
Silicon Motion Targets Agentic AI Storage with MonTitan SSD Reference Design Kit
Silicon Motion's MonTitan SSD RDK targets predictable QoS and persistent storage for demanding Agentic AI workloads. The post Silicon Motion Targets Agentic...
Beschaffung
NEW Ultraminiature 0201 KGU Series RF MLCCs
Engineered to meet the rigorous footprint and reliability demands of next-generation satellite, cellular, and broadband wireless systems, these...
Beschaffung
TrendForce Sees Start of MLCC Industry Upcycle
SEMCO raises MLCC prices amid stronger AI demand, tightening supply and rising utilization across Taiwanese and Chinese suppliers. The post TrendForce Sees...
Beschaffung
FSP Launches Next-Gen 3200W CRPS Power Solutions to Fully Power AI Edge and Next-Generation Data Centers
FSP Group, a global leading power supply manufacturer, leverages its deep R&D capabilities and forward-looking insights into computing architectures to...
Beschaffung
Hot Chips 2026: Cerebras lays out the future of wafer-scale AI — Nexus system architecture triples rack-scale performance, CS-6 wafer to incorporate stacked DRAM
At Hot Chips 2026, Cerebras revealed the next two generations of its wafer-scale accelerator roadmap. It also discussed the benefits of its new Nexus rack...
Beschaffung
China's YMTC aims to become the world's largest NAND maker by the end of 2027, report says — company plans to overtake Samsung and SK hynix
The target would require YMTC to nearly double its market share in 16 months.
Beschaffung
TrendForce: DRAM, NAND Flash to Account for 68% of Major CSP CapEx in 2027
The rapid increase will be driven in part by soaring memory contract prices and robust procurement demand. The post TrendForce: DRAM, NAND Flash to Account...
Beschaffung
Signal für eine MPN gesucht?
Nennen Sie uns die
Artikelnummer.
Marktkontext ist nützlich. Eine konkrete Antwort ist besser. Senden Sie MPN, Menge und Wunschtermin für eine Sourcing-Prüfung.
Angebot anfordern Bestandsindex prüfen sales@schontek.com