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September 09, 2026

DRAM Industry Revenue Up 60% QoQ in 2Q 2026

Growing demand for AI servers has driven higher shipments of HBM3e, LPDDR5X, and high-capacity RDIMMS, according to TrendForce. The post DRAM Industry Revenue Up 60% QoQ in 2Q 2026 appeared first on EE Times Asia .

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September 07, 2026

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

Edgewater Research’s most recent IP&E update indicates that AI & broader market is stronger again; Nvidia Rubin Ultra is targeting 2x backplane density. This August 2026 collection of news summaries, […] Read the original post at August 2026 Interconnect, Passives and Electromechanical Components Market Insights

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September 07, 2026

Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

Knowles has expanded its Cornell Dubilier Flatpack™ portfolio with the Type CLS, a 105°C-rated family of prismatic aluminum electrolytic capacitors in stainless-steel cases. The Knowles CLS series targets applications that […] Read the original post at Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

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September 07, 2026

Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

Vishay Intertechnology has introduced the Sfernice CHEP series of thin film chip resistors for RF and microwave designs that need both high-frequency behaviour and substantial continuous power handling in compact […] Read the original post at Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

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September 07, 2026

Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

Samsung Electro-Mechanics has signed a KRW 1.0722 trillion (approximately USD 780 million) supply agreement with an unnamed global major corporation for multilayer ceramic capacitors used in AI servers. The one-year […] Read the original post at Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

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September 07, 2026

Enterprise SSD Revenue Doubles to Over $37B in 2Q 2026 as AI Demand Lifts Prices, Shipments

AI infrastructure expansion and higher NAND contract prices drove enterprise SSD revenue sharply higher in the second quarter. The post Enterprise SSD Revenue Doubles to Over $37B in 2Q 2026 as AI Demand Lifts Prices, Shipments appeared first on EE Times Asia .

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September 07, 2026

Silicon Motion Targets Agentic AI Storage with MonTitan SSD Reference Design Kit

Silicon Motion's MonTitan SSD RDK targets predictable QoS and persistent storage for demanding Agentic AI workloads. The post Silicon Motion Targets Agentic AI Storage with MonTitan SSD Reference Design Kit appeared first on EE Times Asia .

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September 07, 2026

Component Shortage Alert: FY2028 Supply Constrained

Supply chain update: FY2028 may be experiencing shortage conditions. Published: September 6, 2026 Updated: September 6, 2026 Topic: Market Watch

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September 07, 2026

Component Shortage Alert: RK3566, RK3588, RK182X Supply Constrained

Supply chain update: RK3566, RK3588, RK182X may be experiencing shortage conditions. Published: September 6, 2026 Updated: September 6, 2026 Topic: Market Watch

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September 02, 2026

NEW Ultraminiature 0201 KGU Series RF MLCCs

Engineered to meet the rigorous footprint and reliability demands of next-generation satellite, cellular, and broadband wireless systems, these high-performance, ultra-low-ESR capacitors deliver exceptional stability across an expanded range of miniature and ultraminiature sizes. FOUNTAIN INN, S.C. (September 1, 2026) – KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation a

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September 02, 2026

KEMET HRA X7R High-Reliability MLCCs Target Higher Capacitance in Defense and Aerospace Electronics

KEMET, YAGEO Group has introduced its HRA X7R series as a high-reliability alternative for defense, aerospace, and limited-mission space electronics that need more capacitance in compact MLCC footprints. The KEMET […] Read the original post at KEMET HRA X7R High-Reliability MLCCs Target Higher Capacitance in Defense and Aerospace Electronics

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September 01, 2026

Rigaku Puts Spotlight on Advanced Packaging Metrology at SEMICON Taiwan 2026

Rigaku will showcase X-ray metrology and inspection systems targeting HBM, hybrid bonding and advanced packaging process control. The post Rigaku Puts Spotlight on Advanced Packaging Metrology at SEMICON Taiwan 2026 appeared first on EE Times Asia .

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September 01, 2026

TrendForce Sees Start of MLCC Industry Upcycle

SEMCO raises MLCC prices amid stronger AI demand, tightening supply and rising utilization across Taiwanese and Chinese suppliers. The post TrendForce Sees Start of MLCC Industry Upcycle appeared first on EE Times Asia .

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September 01, 2026

Kioxia and Sandisk Plan $31B Japan Investment to Expand NAND Capacity

Kioxia and Sandisk plan more than $31 billion in Japanese investments through 2032, targeting advanced NAND production and supply stability. The post Kioxia and Sandisk Plan $31B Japan Investment to Expand NAND Capacity appeared first on EE Times Asia .

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September 01, 2026

Bourns UT-A Wirewound Power Resistors Target High-Temperature and Pulse-Load Applications

Bourns has introduced the UT-A Series of through-hole wirewound power resistors for applications requiring stable resistance, pulse capability, and operation at elevated temperatures. The AEC-Q200-compliant resistor series spans 1 W […] Read the original post at Bourns UT-A Wirewound Power Resistors Target High-Temperature and Pulse-Load Applications

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August 29, 2026

FSP Launches Next-Gen 3200W CRPS Power Solutions to Fully Power AI Edge and Next-Generation Data Centers

FSP Group, a global leading power supply manufacturer, leverages its deep R&D capabilities and forward-looking insights into computing architectures to announce two new 3200W Common Redundant Power Supply (CRPS) modules: the FSP3200-20HM (12V output) and FSP3200-21HE (54V output). Designed specifically for next-generation data centers, edge AI servers, and high-density workstations, FSP’s dual-voltage architecture (12V & … Read More → "FSP Launch

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August 29, 2026

YAGEO Expands Aluminum Polymer Capacitors for High-Temperature AI Server Power Rails

YAGEO Group has expanded its AO-CAP® aluminum polymer SMD capacitor portfolio with new A720 and A798 series options aimed at low-voltage, high-current power rails in AI servers and other demanding […] Read the original post at YAGEO Expands Aluminum Polymer Capacitors for High-Temperature AI Server Power Rails

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August 29, 2026

Filter Capacitors in Electric Vehicles: Knowles Safety MLCCs for BMS and Isolated DC/DC Converters

Filter capacitors are essential to controlling conducted electromagnetic interference (EMI) and switching-noise ripple in electric-vehicle battery and power-conversion systems. In high-voltage EV electronics, they can provide line-to-line or line-to-ground noise […] Read the original post at Filter Capacitors in Electric Vehicles: Knowles Safety MLCCs for BMS and Isolated DC/DC Converters

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August 28, 2026

Hot Chips 2026: Cerebras lays out the future of wafer-scale AI — Nexus system architecture triples rack-scale performance, CS-6 wafer to incorporate stacked DRAM

At Hot Chips 2026, Cerebras revealed the next two generations of its wafer-scale accelerator roadmap. It also discussed the benefits of its new Nexus rack design for the CS-4 rack-scale accelerator and the performance of the three WS-3T wafer-scale engines contained within.

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August 28, 2026

China's YMTC aims to become the world's largest NAND maker by the end of 2027, report says — company plans to overtake Samsung and SK hynix

The target would require YMTC to nearly double its market share in 16 months.

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August 28, 2026

TrendForce: DRAM, NAND Flash to Account for 68% of Major CSP CapEx in 2027

The rapid increase will be driven in part by soaring memory contract prices and robust procurement demand. The post TrendForce: DRAM, NAND Flash to Account for 68% of Major CSP CapEx in 2027 appeared first on EE Times Asia .

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August 28, 2026

From Benchmarks to Behavior: Rethinking Performance in Autonomous Robotics

The OpenNav Robotics Workload Benchmark tests autonomous robots running full perception, planning, control, and a 31B VLM simultaneously. AMD Ryzen AI Embedded X100 Series outperforms NVIDIA Jetson T5000 with 3.4x fewer missed control-loop deadlines, 1.6x more spare compute, and 2.7x better CPU utilization—plus 10-year lifecycle, -40–105°C range, AVX-512, and unified memory. Proof that balanced x86 APU beats GPU-first for real-world robotics. The

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August 28, 2026

Keysight Accelerates AttoTude IC Design Cycles by More Than 50%

Keysight Technologies, Inc. (NYSE: KEYS) today announced that AttoTude Inc., a pioneer of next-generation ASICs over Dielectric interconnect technology for AI and hyperscale data center applications, has expanded its use of Keysight EDA software to manage its full IC design workflow. As a result, AttoTude has reduced its design cycles by more than 50% while … Read More → "Keysight Accelerates AttoTude IC Design Cycles by More Than 50%"

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August 28, 2026

Shortage Update: TPS54302, TPS62933, TPS629XX and 6 More Parts Affected

Supply chain update: TPS54302, TPS62933, TPS629XX, TPS563257, LM5013 and 4 more may be experiencing shortage conditions. When a point-of-load rail goes on allocation, the fastest fix is to conduct a parametric search. Filter the search on input range, output current, and

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August 27, 2026

AMD Spartan™ FPGA Grows Up: Bigger, Smarter, Scalable, More Secure

AMD Spartan™ UltraScale+™ SU200P FPGA in Production Built for Data Centers, Network Switches, and Industrial Systems The post AMD Spartan™ FPGA Grows Up: Bigger, Smarter, Scalable, More Secure appeared first on EE Times Asia .

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August 27, 2026

AMD Packs More Memory Capacity, Performance in a Smaller Design with Versal Premium Gen 2 Memory on Package

AMD Versal Premium Gen 2 MoP packs up to 32GB LPDDR5X in-package for 288GB/s bandwidth and 60% smaller footprint, with CXL 3.1/PCIe 6.0, -40–110°C operation, 15-yr lifecycle, and pre-validated memory to accelerate VPX defense, test & measurement, and physical AI edge designs. The post AMD Packs More Memory Capacity, Performance in a Smaller Design with Versal Premium Gen 2 Memory on Package appeared first on EE Times Asia .

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August 27, 2026

KYOCERA AVX Releases Vibration-Proof Aluminum Electrolytic Capacitors

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released two new series of compact, vibration-proof aluminum electrolytic capacitors engineered for harsh industrial environments. Designed to overcome the mechanical stress challenges that have limited the application of aluminum electrolytic capacitors in industrial applications, the … Read Mo

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August 26, 2026

OpenAI’s 700W Jalapeño ASIC outpaces 1,400W Nvidia flagship GPU — claims up to 1.9x throughput per kilowatt and 3.6x lower latency, co-developed with Broadcom

OpenAI arrived at Hot Chips on Tuesday with benchmarks claiming its first in-house chip beats Nvidia's GB300.

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August 26, 2026

Hot Chips 2026: Samsung makes LPDDR5X smart with logic unit in memory — LPDDR5X-PIM is 3.01x faster than LPDDR5X in AI inference with 8x the bandwidth

Samsung detailed the industry's first LPDDR5X-PIM at Hot Chips 2026, adding logic directly to memory to speed up data-intensive workloads like AI inference.

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August 26, 2026

Infineon acquires C2i Semiconductors to expand its innovation capabilities in AI data center power management solutions

Acquisition strengthens Infineon’s leadership in power solutions for AI data centers and accelerates software-defined power architectures from grid to core C2i Semiconductors adds highly differentiated expertise in intelligent digital power management, multiphase controllers and system-level power architectures especially for vertical power delivery including Substrate Integrated Voltages Regulators (SIVR) Transaction expands Infineon’s innovatio

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August 26, 2026

Showcasing Cutting-Edge RF/Microwave Components at IMS 2026

The team is presenting a microwave application seminar about thin-film sputtering technologies and exhibiting its extensive selection of cutting-edge RF and microwave components, including capacitors, couplers, filters, antennas, inductors, and resistive products engineered to solve complex SWaP-C, performance, and reliability challenges in 5G, 6G, IoT, aerospace, defense, radar, and satcom applications. FOUNTAIN INN, S.C. (June 8, 2026) – KYOCER

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August 26, 2026

NEW Vibration-Proof Aluminum Electrolytic Capacitors

The new AEVA and AEVB Series aluminum electrolytic capacitors are engineered for harsh industrial environments, delivering high-CV, long-lifetime performance in compact, surface-mount packages that reliably withstand up to 30g acceleration and operating temperatures extending from -55° to +125°C. FOUNTAIN INN, S.C. (August 25, 2026) – KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technologic

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August 26, 2026

Vishay Releases High-Power Thick Film Resistors for Compact Power Modules

Vishay Intertechnology has released the RPWA 650 series, a new family of thick film power resistors rated at up to 650 W of continuous power in a low-profile package. The […] Read the original post at Vishay Releases High-Power Thick Film Resistors for Compact Power Modules

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August 26, 2026

YAGEO Adds X8 Flexible-Termination Automotive MLCCs for 150°C Designs

YAGEO Group has expanded its automotive MLCC portfolio with VW80808-compliant X8R and X8G capacitors using flexible termination technology. The new YAGEO KEMET-series MLCC ceramic capacitors target compact, high-reliability electronics exposed […] Read the original post at YAGEO Adds X8 Flexible-Termination Automotive MLCCs for 150°C Designs

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August 26, 2026

Component Shortage Alert: CT500SA, CT200SA Supply Constrained

Supply chain update: CT500SA, CT200SA may be experiencing shortage conditions. (Tokyo, Japan – August 19, 2026) Yokogawa Test & Measurement Corporation today announces the release of its second-generation of AC/DC split core curr

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August 25, 2026

Hot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceiling — firm extends MR-MUF through Nvidia Rubin

The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.

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August 25, 2026

Infineon buys C2i Semiconductors

Infineon has bought C2i Semiconductors of Bangalore. C2i specialises in software-defined multiphase controllers and smart power stages for AI data center applications. “We founded C2i Semiconductors with the vision of […] The post Infineon buys C2i Semiconductors appeared first on Electronics Weekly .

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August 25, 2026

Radiation Tolerance of Tantalum Polymer Capacitors

Environments rich in ionizing radiation create a particularly difficult functional challenge for electronic components. Spacecraft, nuclear reactors, particle accelerators, and hardened military equipment (to name a few examples) demand that their electrical systems operate correctly, even in the presence of high energy particles, cosmic rays, X-rays, and the like. Such radiation adversely affects electronics in […] The post Radiation Tolerance o

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August 21, 2026

Component Shortage Alert: ADP1876 Supply Constrained

Supply chain update: ADP1876 may be experiencing shortage conditions. Published: August 20, 2026 Updated: August 20, 2026 Topic: EOL Alert

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August 20, 2026

Microchip advances PolarFire FPGA Ethernet Sensor Bridge with Rev 2.0

Microchip Technology has released Revision 2.0 of its PolarFire FPGA Ethernet Sensor Bridge. This is a smaller, production-ready board for sensor integration using NVIDIA HSB (Holoscan Sensor Bridge) technology. The […] The post Microchip advances PolarFire FPGA Ethernet Sensor Bridge with Rev 2.0 appeared first on Electronics Weekly .

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August 18, 2026

Memory prices climb 500% in 12 months, up to 10x the lowest ever tracked prices — 128GB of DDR5 now $3,399

Analysis of historical price data trends indicates that the memory crisis has driven RAM prices to never-before-seen heights.

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August 18, 2026

Component Shortage Alert: GD32H77R Supply Constrained

Supply chain update: GD32H77R may be experiencing shortage conditions. Published: August 18, 2026 Updated: August 18, 2026 Topic: technology-guide

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August 17, 2026

Component Shortage Alert: TS332IST Supply Constrained

Supply chain update: TS332IST may be experiencing shortage conditions. Hello, We are facing shortage issues with TS332IST, we need an alternative replacement for this component as soon as possible, as our shortage is comi

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August 17, 2026

Component Shortage Alert: 36PDT, 12PDT Supply Constrained

Supply chain update: 36PDT, 12PDT may be experiencing shortage conditions. I have in front of me a parallel port switch box, consisting of three Centronics ports - common, A and B - connected via a rotary switch that appears

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August 17, 2026

Component Shortage Alert: GB300, NVL72 Supply Constrained

Supply chain update: GB300, NVL72 may be experiencing shortage conditions. Published: July 17, 2026 Updated: July 17, 2026 Topic: Market Watch

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August 17, 2026

Component Shortage Alert: STM32H543, STM32H553 Supply Constrained

Supply chain update: STM32H543, STM32H553 may be experiencing shortage conditions. Published: July 20, 2026 Updated: August 11, 2026 Topic: Market Watch

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August 17, 2026

Shortage Update: AD9361, AD9361BBCZ, AD9363 and 1 More Parts Affected

Supply chain update: AD9361, AD9361BBCZ, AD9363, AD9364 may be experiencing shortage conditions. Published: August 2, 2026 Updated: August 2, 2026 Topic: Hot Part

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August 17, 2026

Shortage Update: VSC8479, VSC8479YHQ-01, VSC8479YYY and 1 More Parts Affected

Supply chain update: VSC8479, VSC8479YHQ-01, VSC8479YYY, VSC8479YHQ-02 may be experiencing shortage conditions. Published: August 13, 2026 Updated: August 13, 2026 Topic: EOL Alert

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August 12, 2026

TDK vibration-resistant axial capacitors for 125 V

Addressing what it sees as increasing demand for compact and high-ripple-current DC-link capacitor banks, TDK is expanding its axial/soldering star-aluminium electrolytic capacitor lineup. This is both adding 125 V-rated components […] The post TDK vibration-resistant axial capacitors for 125 V appeared first on Electronics Weekly .

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August 12, 2026

Component Shortage Alert: SOT23, SOT143B Supply Constrained

Supply chain update: SOT23, SOT143B may be experiencing shortage conditions. The USBLC6-2SC6 is one of the most designed-in ESD protection parts on USB and high speed data lines, which keeps it in steady demand. This page is a

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August 12, 2026

Shortage Update: STM32, STM32F4, STM32F407 and 6 More Parts Affected

Supply chain update: STM32, STM32F4, STM32F407, GD32F407, GD32 and 4 more may be experiencing shortage conditions. A Findchips sourcing guide. Overview Evaluating STM32 alternatives was once a practice adopted only during times of shortage. However, seeking second

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