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Infineon extends collaboration with SolarEdge to enable solid-state protection for 800 VDC AI data centers
Companies extend collaboration into solid-state circuit breaker (SSCB) technology in line with leading industry framework for 800 Volts direct current (VDC)...
ソーシング
SEGGER J-Link debug probe fully validated for STMicroelectronics’ StellarStudio
SEGGER and STMicroelectronics have worked closely together to ensure robust, high-performance support for current and future Stellar devices, with J-Link...
ソーシング
STMicroelectronics’ highly integrated power-factor correction controller simplifies continuous conduction mode designs
STMicroelectronics’ L4983 power-factor correction (PFC) controller contains a proprietary multiplier emulator and distortion-optimization circuitry, letting...
ソーシング
TDK launches industry-leading low-resistance soft-termination X7R MLCCs with 10 μF/100 V in the 3225 format for AI servers, humanoids, and xEVs
– New 100 V SMD component with X7R characteristics has a capacitance of 10 μF in the 3225 format. – Offers low resistance and soft termination for...
ソーシング
Enterprise SSD Revenue Doubles to Over $37B in 2Q 2026 as AI Demand Lifts Prices, Shipments
AI infrastructure expansion and higher NAND contract prices drove enterprise SSD revenue sharply higher in the second quarter. The post Enterprise SSD...
ソーシング
Silicon Motion Targets Agentic AI Storage with MonTitan SSD Reference Design Kit
Silicon Motion's MonTitan SSD RDK targets predictable QoS and persistent storage for demanding Agentic AI workloads. The post Silicon Motion Targets Agentic...
ソーシング
NEW Ultraminiature 0201 KGU Series RF MLCCs
Engineered to meet the rigorous footprint and reliability demands of next-generation satellite, cellular, and broadband wireless systems, these...
ソーシング
TrendForce Sees Start of MLCC Industry Upcycle
SEMCO raises MLCC prices amid stronger AI demand, tightening supply and rising utilization across Taiwanese and Chinese suppliers. The post TrendForce Sees...
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FSP Launches Next-Gen 3200W CRPS Power Solutions to Fully Power AI Edge and Next-Generation Data Centers
FSP Group, a global leading power supply manufacturer, leverages its deep R&D capabilities and forward-looking insights into computing architectures to...
ソーシング
Hot Chips 2026: Cerebras lays out the future of wafer-scale AI — Nexus system architecture triples rack-scale performance, CS-6 wafer to incorporate stacked DRAM
At Hot Chips 2026, Cerebras revealed the next two generations of its wafer-scale accelerator roadmap. It also discussed the benefits of its new Nexus rack...
ソーシング
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