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72 件のノート
AMD Spartan™ FPGA Grows Up: Bigger, Smarter, Scalable, More Secure
AMD Spartan™ UltraScale+™ SU200P FPGA in Production Built for Data Centers, Network Switches, and Industrial Systems The post AMD Spartan™ FPGA Grows Up:...
ソーシング
AMD Packs More Memory Capacity, Performance in a Smaller Design with Versal Premium Gen 2 Memory on Package
AMD Versal Premium Gen 2 MoP packs up to 32GB LPDDR5X in-package for 288GB/s bandwidth and 60% smaller footprint, with CXL 3.1/PCIe 6.0, -40–110°C...
Shortage
KYOCERA AVX Releases Vibration-Proof Aluminum Electrolytic Capacitors
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future,...
ソーシング
OpenAI’s 700W Jalapeño ASIC outpaces 1,400W Nvidia flagship GPU — claims up to 1.9x throughput per kilowatt and 3.6x lower latency, co-developed with Broadcom
OpenAI arrived at Hot Chips on Tuesday with benchmarks claiming its first in-house chip beats Nvidia's GB300.
ソーシング
Hot Chips 2026: Samsung makes LPDDR5X smart with logic unit in memory — LPDDR5X-PIM is 3.01x faster than LPDDR5X in AI inference with 8x the bandwidth
Samsung detailed the industry's first LPDDR5X-PIM at Hot Chips 2026, adding logic directly to memory to speed up data-intensive workloads like AI inference.
ソーシング
Infineon acquires C2i Semiconductors to expand its innovation capabilities in AI data center power management solutions
Acquisition strengthens Infineon’s leadership in power solutions for AI data centers and accelerates software-defined power architectures from grid to core...
ソーシング
Showcasing Cutting-Edge RF/Microwave Components at IMS 2026
The team is presenting a microwave application seminar about thin-film sputtering technologies and exhibiting its extensive selection of cutting-edge RF and...
ソーシング
NEW Vibration-Proof Aluminum Electrolytic Capacitors
The new AEVA and AEVB Series aluminum electrolytic capacitors are engineered for harsh industrial environments, delivering high-CV, long-lifetime...
ソーシング
Component Shortage Alert: CT500SA, CT200SA Supply Constrained
Supply chain update: CT500SA, CT200SA may be experiencing shortage conditions. (Tokyo, Japan – August 19, 2026) Yokogawa Test & Measurement Corporation...
Shortage
Hot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceiling — firm extends MR-MUF through Nvidia Rubin
The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.
ソーシング
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