LG Innotek has demonstrated flip-chip ball grid array (FC-BGA) substrate samples that embed silicon capacitors within the package substrate for AI semiconductor applications. The announced approach places the capacitor closer […] Read the original post at LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery
LG Innotek has demonstrated flip-chip ball grid array (FC-BGA) substrate samples that embed silicon capacitors within the package substrate for AI semiconductor applications. The announced approach places the capacitor closer […] Read the original post at LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery
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*Source: [PassiveComponentsEU](https://passive-components.eu/lg-innotek-demonstrates-fc-bga-substrates-with-embedded-silicon-capacitors-for-ai-power-delivery/)*